High-Density Hardware

Android Motherboard Cluster for App QA

20 headless Android motherboard nodes · high-density 2U · centralized power · ADB automation

20-node screenless Android motherboard cluster for headless QA, automation, and high-density device lab scaling.

Reference price (USD)

$1,680

Reference price (USD). Final quote confirmed before payment — written proforma, burn-in QC, and freight terms from Guangzhou sales.

In Stock (8)
Node capacity20 nodes
MOQ1 unit
Lead time5–7 business days
DeploymentHigh-Density Deployment
Typical useHeadless Android QA at scale
Request Factory Quote

Reference price only — final quote confirmed before payment. Cart checkout for confirmed standard SKUs.

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  • Standard configuration
  • Pre-shipment testing
  • Packed before export
  • Custom rack quoted separately

Overview

High-density motherboard cluster mounts up to 20 Android motherboards in one cooled enclosure. Batteries removed; centralized power replaces per-device charging. Built for headless app testing and automation where display output is not required.

  • 20 screenless Android motherboard nodes
  • Lower footprint vs full-phone chassis
  • Centralized PSU and cooling
  • ADB-ready for headless automation
  • Modular expansion with additional chassis

Best for: Headless Android QA at scale

Procurement & Export

MOQ, lead time, packing, voltage, warranty, shipping, and payment — factory-direct from Guangzhou.

Swipe horizontally to view full spec table →

MOQ1 unit
Lead time5–7 business days
Packing size (W×D×H)21.26 × 14.37 × 7.28 in (540 × 365 × 185 mm)
Gross weight≈13 lb (6 kg) chassis only — confirm with devices on quote
Input voltage110V–220V AC universal input (region-appropriate plug supplied)
Warranty12-month manufacturing defect warranty from delivery
Shipping methodExpress courier (DHL/FedEx/UPS) or sea freight from Guangzhou — see /shipping
Payment processUSDT Tron TRC20 online checkout (30 min window) or T/T / Wise / PayPal invoice via sales

Key Specifications

Hardware parameters for procurement review. Configurable values confirmed before production.

Swipe horizontally to view full spec table →

Node capacity20-node high-density motherboard cluster
Device typeScreenless Android motherboards (model confirmed before build)
Chassis / rack type2U high-density enclosure for headless nodes
Power input110V–220V AC
Power distributionCentralized PSU replacing per-device batteries
Cooling4-fan optimized airflow
Cable managementUSB routing backplane with grouped ADB paths
Network requirementManaged switch recommended for 20+ headless nodes
Remote operation supportADB automation baseline; group control optional
Typical deploymentHeadless app QA, high-density automation, backend service testing
Customization optionsMotherboard model and slot layout — confirmed before assembly
Packing / shipping noteThermal burn-in under load; export crating for international freight
Device TypeAndroid motherboard (screenless)
Node Count20
Form Factor2U high-density chassis
Power Design550W industrial PSU
Remote OperationADB automation supported
Typical UseHeadless QA, automation at scale
CustomizationMotherboard model confirmed before build
Download spec sheet (PDF) →

Hardware Details

Chassis layout, power and cooling, and pre-shipment verification — separate from the spec sheet above.

Chassis & layout

  • Motherboard cluster chassis
  • Centralized PSU & fan assembly
  • USB routing backplane
  • Mounting hardware

Power, cooling & cabling

  • 20 screenless Android motherboard nodes
  • Lower footprint vs full-phone chassis
  • Centralized PSU and cooling
  • ADB-ready for headless automation

Pre-shipment check & packing

  • Motherboard slot alignment check
  • Thermal burn-in under load
  • Export crating for international freight
  • Engineering handoff documentation

Use Cases

Commercial deployment scenarios for phone farm hardware and device lab operations.

  • Headless Android app automation
  • High-density QA without display overhead
  • Scaling device lab node count per rack unit
  • Backend service testing on real silicon

Product FAQ

How many nodes should I choose?+

Starter and Pro boxes ship with 20 real Android device positions. Choose a turnkey bundle if you want chassis, power, cooling, and network baseline in one order. Contact sales for 40+ node rack layouts.

Can I customize Android version or device model?+

Yes. Tell us your target Android version and preferred device models when ordering. We confirm compatibility before assembly and pre-shipment testing.

Is remote control supported?+

All chassis SKUs support ADB-based remote operation. Optional remote control workstation setup is available as a separate service after hardware delivery.

What is the lead time?+

In-stock standard configurations typically ship in 3–5 business days from Guangzhou. Custom rack projects are quoted separately.

How is shipping handled?+

We export with commercial invoice and offer express courier or sea freight. Share your shipping country on the contact form for a freight estimate.

What payment options are available?+

Online checkout accepts USDT (TRC20) at the USD amount shown. Bank transfer (T/T), Wise, and PayPal are available via manual invoice — contact sales@phonefarm.fun. Card payments are not supported on this site.

What's Included

  • Motherboard cluster chassis
  • Centralized PSU & fan assembly
  • USB routing backplane
  • Mounting hardware

Need a custom layout?

Share node count, device models, shipping country, and remote setup requirements. We confirm configuration before production.

Send Hardware Requirement

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Factory sales · Guangzhou, China

Quote for Android Motherboard Cluster for App QA

Share node count, device models, and shipping country. Our Guangzhou team responds with pricing and configuration guidance within 24 hours.

@huicheng1998 · qiuxui646@gmail.com