PhoneFarm Fun
Android Motherboard Cluster for App QA
20-node screenless Android motherboard cluster for headless QA, automation, and high-density device lab scaling.
Reference price: $1,680 USD · MOQ 1 · Lead time: 5–7 business days
Overview
High-density motherboard cluster mounts up to 20 Android motherboards in one cooled enclosure. Batteries removed; centralized power replaces per-device charging. Built for headless app testing and automation where display output is not required.
Key features
- 20 screenless Android motherboard nodes
- Lower footprint vs full-phone chassis
- Centralized PSU and cooling
- ADB-ready for headless automation
- Modular expansion with additional chassis
Technical specifications
| Node capacity | 20-node high-density motherboard cluster |
| Device type | Screenless Android motherboards (model confirmed before build) |
| Chassis / rack type | 2U high-density enclosure for headless nodes |
| Power input | 110V–220V AC |
| Power distribution | Centralized PSU replacing per-device batteries |
| Cooling | 4-fan optimized airflow |
| Cable management | USB routing backplane with grouped ADB paths |
| Network requirement | Managed switch recommended for 20+ headless nodes |
| Remote operation support | ADB automation baseline; group control optional |
| Typical deployment | Headless app QA, high-density automation, backend service testing |
| Customization options | Motherboard model and slot layout — confirmed before assembly |
| Packing / shipping note | Thermal burn-in under load; export crating for international freight |
| Device Type | Android motherboard (screenless) |
| Node Count | 20 |
| Form Factor | 2U high-density chassis |
| Power Design | 550W industrial PSU |
| Remote Operation | ADB automation supported |
| Typical Use | Headless QA, automation at scale |
| Customization | Motherboard model confirmed before build |
Node capacity
20 nodes
Deployment type
High-Density Deployment
Typical use
Headless Android QA at scale
Factory location
Guangzhou, China